Title: Epoxy Resins for Downhole Composites: Breaking the Performance – Processability Paradigm

Authors: Prashanth Badrinarayanan, Huifeng Qian, and Tyler Runk

DOI: 10.33599/nasampe/c.19.0672

Abstract: Composites used in downhole applications are expected to withstand temperatures of 350 oF and higher, which requires the use of thermosetting resins that can deliver high glass transition temperatures (Tg) following cure; however, high Tg resins can either experience residual stress-induced damage during cure, or due to the brittle nature of the polymer matrix, become more susceptible to impact damage following cure. Typical approaches to either enhance Tg or improve toughness have a detrimental effect on viscosity and processability of the resin. In this work, we present a novel approach to achieve a unique balance between desired performance features such as high Tg and fracture toughness of the epoxy matrix with the critical processing parameters such as viscosity and pot life. Experimental protocols developed to assess the performance and suitability of the novel toughened, high Tg resin formulation as a matrix for downhole applications will be presented. A thermal shock assessment will be used to test the ability of the toughened matrix to withstand thermally induced residual stress during cure. The effect of the block copolymer toughening agent on the physical properties following cure will be assessed. Water resistance and minimizing the effect of matrix plasticization is crucial for effective deployment of thermoset polymers in downhole applications. Consequently, in this work, we explore the effect of the toughening agent on the water resistance of the cured epoxy matrix.

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Conference: CAMX 2019

Publication Date: 2019/09/23

SKU: TP19-0672

Pages: 13

Price: $26.00