Title: Nanomechanical Property Characterization of Adhesive Bondlines

Authors: Austin C. Zukaitis, Rita J. Olander, and Brian D. Flinn

DOI: 10.33599/nasampe/c.19.0836

Abstract: This research is directed toward further understanding how manufacturing methods affect initial bond line formation between matrix resins and adhesives. Nanoindentation techniques were used to characterize various regions of adhesively bonded carbon fiber epoxy samples including the matrix resin, adhesive, scrim, and bondline mixing zone (interface/interphase). Bondlines from a co-bonded system were characterized to understand the differences in interface and/or interphase development. Co-bonds produce a mixing of the matrix resin and the adhesive, resulting in a mixed interface, or interphase region, as compared to a sharper interface produced by secondarily bonded samples. For this preliminary study, one film adhesive bonding system was characterized using the following nanoindentation techniques: dynamic mechanical analysis (nanoDMA), single indentation, and extreme property mapping (XPM). By measuring mechanical responses on the micron scale, the data identifies various structures and regions, such as where the adhesive/adherend interphase begins, and if it is heterogeneous or homogeneous in nature. This preliminary work is unique in that other characterization methods have not been able to isolate the adhesive/adherend interphase due to the nano scale of this region. These methods not only measure the adhesive/adherend interphase thickness but also allow for the evaluation of properties that may be related to bond quality and performance.

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Conference: CAMX 2019

Publication Date: 2019/09/23

SKU: TP19-0836

Pages: 13

Price: $26.00