Title: Joining, Disassembly, and Reconfiguration of Thermoplastic Composites for Space Applications
Authors: Joseph J. Pinakidis, Sandi G. Miller
DOI: 10.33599/nasampe/c.24.0226
Abstract: Thermoplastic composites are increasingly being investigated for aerospace applications because of their relatively short processing time, good chemical and radiation resistance, and potential for reforming and reuse via melting. The manufacturing, reforming, and reuse of thermoplastic composites can be leveraged to advance joining, disassembly, and on-site reassembly of structures for space exploration activities. Potential applications include, but are not limited to, habitats and on-orbit assembly and reassembly of large-scale truss structures. This work focuses on demonstrating the feasibility of joining, disassembly, and reassembly of a thermoplastic bond using heat and pressure. Polyether ether ketone (PEEK) composite adherends were joined using low-melt polyaryl ether ketone (LM-PAEK) thermoplastic films at the bonding interface. The single lap shear specimens with LM-PAEK film were tested and had a maximum shear strength between 5 and 8 MPa and consistently failed adhesively at the bondline. Reassembly of disassembled specimens was successfully demonstrated using additional thermoplastic interlayers. Thus, the reassembly of thermoplastic composite joints was found to be feasible. However, additional work is required to reduce film flowout and optimize consolidation parameters for an in space environment.
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Conference: CAMX 2024 | San Diego CA
Publication Date: 2024/9/9
SKU: TP24-0000000226
Pages: 13
Price: $26.00
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