Title: Development of A 250°F Cure Film Adhesive for Bonding of Metal and Composite Structures

Authors: Natalia Rivera-Gonzalez

DOI: 10.33599/nasampe/c.24.0264

Abstract: Adhesive bonding is one of the preferred methods for joining structural components in an aircraft since it provides uniform stress of metal and composite substrates, reduces weight, and offers a cost-effective solution that is less labor-intensive. Based on the structures that need to be bonded and the design specifications, adhesives can be applied with either a 250 °F or 350 °F cure temperature, depending on the specific application and needs. The current structural film adhesives available in the aerospace market for 250 °F applications exhibit an imbalance between toughness and high strength at elevated temperatures, as well as optimal performance in hot/wet conditions. In order to address these challenges, we have developed a new film adhesive tailored to meet these characteristics that provide exceptional performance for metal and composite bonding. In the design of this new film adhesive, we considered attributes such as toughness, elevated service temperature capabilities, performance in hot and wet conditions, and cure flexibility. The work presented in this paper covers the evaluation of thermal properties and mechanical behavior under various environmental conditions and curing profiles for this new film adhesive. This evaluation will highlight the viability of implementing this technology for bonding metal and composite structures within the aerospace industry.

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Conference: CAMX 2024 | San Diego CA

Publication Date: 2024/9/9

SKU: TP24-0000000264

Pages: 13

Price: $26.00