Search

DIGITAL LIBRARY: SAMPE 2020 | VIRTUAL SERIES

Get This Paper

High-Performance Materials for Mask-Projection Stereolithography Via In-Situ Sequential Interpenetrating Network

Description

Title: High-Performance Materials for Mask-Projection Stereolithography Via In-Situ Sequential Interpenetrating Network

Authors: Anh N. Huynh, Nicolas J. Alvarez and Giuseppe R. Palmese

DOI: 10.33599/nasampe/s.20.0099

Abstract: Stereolithography, a common technique used in additive manufacturing, offers high dimensional accuracy. However, there are limited choices of materials for this process. Acrylates and epoxies are commonly used, but their thermal properties are not suitable for applications in which high temperature performance is needed. In contrast, high-performance thermosets such as bismaleimide and cyanate ester are cured using high temperature processing techniques, and their use for stereolithography is limited. In this work, a photocurable formulation of bismaleimide, a reactive diluent, and cyanate ester was developed to improve thermal and mechanical properties as well as cure shrinkage of stereolithography resins. In-situ sequential interpenetrating polymer network (IPN) were investigated wherein the copolymerization reaction between bismaleimide and diluent occurs during printing, resulting in a cyanate ester swollen network with sub room temperature glass transition temperature (Tg). The polymerization of cyanate ester takes place during post processing. The resulting material possesses a Tg well above 200oC (loss modulus peak), significant decrease in cure shrinkage, and improved toughness.

References: [1] Guo N. and Leu M. C., "Additive manufacturing: technology, applications and research needs," Frontiers of Mechanical Engineering, vol. 8, no. 3, pp. 215-243, 2013. DOI: 10.1007/s11465-013-0248-8 [2] Ligon S. C., Liska R., Stampfl J., Gurr M., and Mülhaupt R., "Polymers for 3D printing and customized additive manufacturing," 2017. DOI: 10.1021/acs.chemrev.7b00074 [3] Chandrasekaran S., Duoss E. B., Worsley M. A., and Lewicki J. P., "3D printing of high performance cyanate ester thermoset polymers," Journal of Materials Chemistry A, vol. 6, no. 3, pp. 853-858, 2018. DOI: 10.1039/C7TA09466C [4] Hegde M. et al., "3D printing all‐aromatic polyimides using mask‐projection stereolithography: processing the nonprocessable," Advanced Materials, vol. 29, no. 31, p. 1701240, 2017. DOI: 10.1002/adma.201701240 [5] Zhang X., Xu Y., Li L., Yan B., Bao J., and A. Zhang, "Acrylate‐based photosensitive resin for stereolithographic three‐dimensional printing," Journal of Applied Polymer Science, vol. 136, no. 21, p. 47487, 2019. DOI: 10.1002/app.47487 [6] Kuang X., Zhao Z., Chen K., Fang D., Kang G., and Qi H. J., "High‐Speed 3D Printing of High‐Performance Thermosetting Polymers via Two‐Stage Curing," Macromolecular rapid communications, vol. 39, no. 7, p. 1700809, 2018. DOI: 10.1002/marc.201700809 [7] Bychkov P., A. Chentsov, Kozintsev V., and Popov A., "Determination of residual stresses in objects at their additive manufacturing by layer-by-layer photopolymerization method," in Journal of Physics: Conference Series, 2018, vol. 991, no. 1, p. 012016: IOP Publishing. [8] Karalekas D., Rapti D., Gdoutos E., and Aggelopoulos A., "Investigation of shrinkage-induced stresses in stereolithography photo-curable resins," Experimental mechanics, vol. 42, no. 4, pp. 439-444, 2002. DOI: 10.1007/BF02412150 [9] Shah D. U. and Schubel P. J., "Evaluation of cure shrinkage measurement techniques for thermosetting resins," Polymer Testing, vol. 29, no. 6, pp. 629-639, 2010. DOI: 10.1016/j.polymertesting.2010.05.001 [10] Palmese G. and Gillham J., "Time–temperature–transformation (TTT) cure diagrams: Relationship between Tg and the temperature and time of cure for a polyamic acid/polyimide system," Journal of applied polymer science, vol. 34, no. 5, pp. 1925-1939, 1987. DOI: 10.1002/app.1987.070340511 [11] Lange J., Toll S., Månson J.-A. E., and Hult A., "Residual stress build-up in thermoset films cured above their ultimate glass transition temperature," Polymer, vol. 36, no. 16, pp. 3135-3141, 1995. DOI: 10.1016/0032-3861(95)97876-H [12] Li W., Noodeh M. B., Delpouve N., Saiter J.-M., Tan L., and Negahban M., "Printing continuously graded interpenetrating polymer networks of acrylate/epoxy by manipulating cationic network formation during stereolithography," Express Polymer Letters, vol. 10, no. 12, 2016. [13] Sitzmann E. V., Anderson R. F., Koljack M. P., Cruz J. G., and Srivastava C. M., "High temperature performance polymers for stereolithography," ed: Google Patents, 2000. [14] Iredale R. J., Ward C., and Hamerton I., "Modern advances in bismaleimide resin technology: A 21st century perspective on the chemistry of addition polyimides," Progress in Polymer Science, vol. 69, pp. 1-21, 2017. DOI: 10.1016/j.progpolymsci.2016.12.002 [15] Hamerton I. and Hay J. N., "Recent developments in the chemistry of cyanate esters," Polymer international, vol. 47, no. 4, pp. 465-473, 1998. DOI: 10.1002/(SICI)1097-0126(199812)47:4<465::AID-PI88>3.0.CO;2-S [16] Nair C. R., Mathew D., and Ninan K., "Cyanate ester resins, recent developments," in New Polymerization Techniques and Synthetic Methodologies: Springer, 2001, pp. 1-99. [17] Gu A., "High performance bismaleimide/cyanate ester hybrid polymer networks with excellent dielectric properties," Composites Science and Technology, vol. 66, no. 11-12, pp. 1749-1755, 2006. DOI: 10.1016/j.compscitech.2005.11.001 [18] Geng X., "Bismaleimide and cyanate ester based sequential interpenetrating polymer networks for high temperature application," 2005. [19] Hamerton I., "High-performance thermoset-thermoset polymer blends: A review of the chemistry of cyanate ester-bismaleimide blends," High performance polymers, vol. 8, no. 1, pp. 83-95, 1996. DOI: 10.1088/0954-0083/8/1/006 [20] Fan S., Boey F., and Abadie M., "UV curing of a liquid based bismaleimide-containing polymer system," Exp Polym Lett, vol. 1, pp. 397-405, 2007. DOI: 10.3144/expresspolymlett.2007.56 [21] Francis L., McCormick A., Vaessen D., and Payne J., "Development and measurement of stress in polymer coatings," Journal of Materials Science, vol. 37, no. 22, pp. 4717-4731, 2002. DOI: 10.1023/A:1020886802632 [22] Ligon-Auer S. C., Schwentenwein M., Gorsche C., Stampfl J., and Liska R., "Toughening of photo-curable polymer networks: a review," Polymer Chemistry, vol. 7, no. 2, pp. 257-286, 2016. DOI: 10.1039/C5PY01631B [23] Sperling L. H., "Interpenetrating polymer networks: an overview," ACS Publications, 1994. DOI: 10.1021/ba-1994-0239.ch001 [24] Lin M. S., Liu C. C., and Lee C. T., "Toughened interpenetrating polymer network materials based on unsaturated polyester and epoxy," Journal of Applied Polymer Science, vol. 72, no. 4, pp. 585-592, 1999. DOI: 10.1002/(SICI)1097-4628(19990425)72:4<585::AID-APP15>3.0.CO;2-M

Conference: SAMPE 2020 | Virtual Series

Publication Date: 2020/06/01

SKU: TP20-0000000099

Pages: 9

Price: FREE

Get This Paper