Title: Damage Tolerant Composites Reinforced with Z-Axis Milled Carbon Fiber
Authors: Anvesh Gurijala, Dr. Rasam Soheilian and Derek Mossop
DOI: 10.33599/nasampe/s.20.0138
Abstract: Despite having high specific strength and stiffness, carbon fiber composites are prone to brittle and catastrophic failure. This behavior poses challenges when re-designing metal components with light and stiff composites, especially components with thin walls that are common in electronic devices. In this work, thin (~0.8 mm thickness) panels made with 30% Z-axis milled carbon fiber and 70% unidirectional (0°) carbon fiber (tradename: Supercomp™ 1015 Axial) are shown to match the flexural modulus and strength (per ASTM D-790) of 100% unidirectional (0°) carbon fiber panels with similar thickness and weight. Unlike the pure unidirectional fiber laminates, which fail catastrophically, the panels reinforced with Z-axis milled fiber can be loaded again after initial failure and they retain 42% of their original flexural strength. This work demonstrates a new approach to produce damage tolerant composites using Z-axis milled fiber reinforcement and is relevant for light and stiff enclosure designs for electronic devices.
References: [1] Contract consumer electronics, injection molding, enclosure opportunities. Venture Outsource, 2013. [2] Apple says iPad Pros have no design flaw. TechNewsToday, 2019. [3] P. Malnati, Consumer electronics: hybrid composite covers. CompositesWorld, 2019. [4] 301 Technical Data Sheet. Mitsubishi Carbon Fiber and Composites, 2019. [5] Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials. ASTM International, 2019. [6] Torayca T700S Data Sheet. Toray, 2019. [7] Materials 2019, 12(18), 2959; https://doi.org/10.3390/ma12182959 [8] A. Holst, Replacement cycle length of smartphones in the United States 2014-2023, in years. Statista, 2019
Conference: SAMPE 2020 | Virtual Series
Publication Date: 2020/06/01
SKU: TP20-0000000138
Pages: 7
Price: FREE
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