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Nanomechanical Property Characterization of Composite Adhesive Bonding Systems


Title: Nanomechanical Property Characterization of Composite Adhesive Bonding Systems

Authors: Rita J. Olander, Brian D. Flinn, Ashley C. Tracey

DOI: 10.33599/nasampe/s.21.0569

Abstract: This research is directed toward further understanding how manufacturing methods affect initial bondline formation between matrix resins and adhesives. Nanoindentation techniques were used to characterize various regions of adhesively bonded carbon fiber epoxy samples including the matrix resin, adhesive, and bondline mixing zone (interface/interphase). Bondlines from two co-bonded systems (Toray 3900/3MAF 555 and Toray 3900/Solvay FM309-1) and one secondarily bonded (Toray 3900/Cytec Metlbond® 1515-4) were characterized to understand the differences in interface and/or interphase development. Co-bonds produce a mixing of the matrix resin and the adhesive, resulting in a mixed interface, or interphase region, as compared to a sharper interface produced by secondarily bonded samples. For this preliminary study, three specific bonding systems were characterized using nanoindentation extreme property mapping (XPM™). By measuring mechanical responses on the micron scale, the data identifies various structures and regions, such as where the adhesive/adherend interphase begins, and if it is heterogeneous or homogeneous in nature. This work is unique in that other mechanical property characterization methods have not been able to isolate the adhesive/adherend interphase due to the micron scale of this region. These methods not only measure the adhesive/adherend interphase thickness but also allow for the evaluation of properties that may be related to bond quality and performance.

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Conference: SAMPE NEXUS 2021

Publication Date: 2021/06/29

SKU: TP21-0000000569

Pages: 16

Price: FREE

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