Title: New High Performance, Low Temperature Curing Paste Adhesives

Authors: J. Jeffrey Sang and Ian P. Aspin

DOI: 10.33599/nasampe/s.22.0702

Abstract: Many well established industries have ambitions to maximize throughput whilst minimizing manufacturing costs, one factor amongst many being the reduction of operating energy costs. In industries using composite materials, advances in manufacture process techniques and lower temperature cure products have reduced the cost of part manufacture compared to traditional high temperature autoclave methods. Where parts need to be joined, further advances can be made by using adhesives rather than fasteners. Ambient to low temperature curing adhesives can help reduce operating energy costs, but care has to be taken to ensure bonded joint integrity, strengths and resilience are maintained compared to high temperature variants.

To meet the needs of customers, Solvay Composite Materials has developed a range of paste adhesive products for structural bonding of metal and composite with strengths similar to those obtained using heat cured adhesive films. This enables automated assembly and repair of parts to lower manufacturing costs and maintain high performance. Whilst Solvay paste adhesive portfolio includes several one- and two-part paste adhesives with a broad low to high cure temperature processing range, this paper focusses on the challenges in handling, performance, HSE and cure kinetics of ambient temperature curing paste adhesive systems and the subsequent development and application of new products.

References: [1] May, Epoxy resins, Chemistry and Technology. 2nd ed., New York, Dekker, 1988 and references cited therein [2] Comyn, Adhesion Science 1st ed., Letchworth, Royal Society of Chemistry, 1997 and references cited therein

Conference: SAMPE 2022

Publication Date: 2022/05/23

SKU: TP22-0000000702

Pages: 14

Price: $28.00